The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2016
Filed:
Apr. 19, 2013
Applicant:
Rensselaer Polytechnic Institute, Troy, NY (US);
Inventors:
Robert F. Karlicek, Mechanicville, NY (US);
James Jian-Qiang Lu, Watervliet, NY (US);
Charles Sanford Goodwin, Latham, NY (US);
Anton Tkachenko, Troy, NY (US);
Assignee:
RENSSELAER POLYTECHNIC INSTITUTE, Troy, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 21/6836 (2013.01); H01L 24/05 (2013.01); H01L 24/75 (2013.01); H01L 24/76 (2013.01); H01L 24/95 (2013.01); H01L 24/24 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/82 (2013.01); H01L 24/83 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H01L 2221/68386 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/245 (2013.01); H01L 2224/24225 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75283 (2013.01); H01L 2224/75655 (2013.01); H01L 2224/75701 (2013.01); H01L 2224/75733 (2013.01); H01L 2224/75801 (2013.01); H01L 2224/76655 (2013.01); H01L 2224/76701 (2013.01); H01L 2224/76733 (2013.01); H01L 2224/76801 (2013.01); H01L 2224/82002 (2013.01); H01L 2224/82102 (2013.01); H01L 2224/82143 (2013.01); H01L 2224/83002 (2013.01); H01L 2224/8323 (2013.01); H01L 2224/83143 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/95101 (2013.01); H01L 2224/95144 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0066 (2013.01);
Abstract
Disclosed herein is a method of assembling an array of light emitting diode (LED) dies on a substrate comprising: positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto magnets that are arranged at pre-determined locations either on or near the substrate; and forming permanent connections between the dies and the substrate thereby constituting an array of LED dies on a substrate.