The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2016
Filed:
Dec. 26, 2013
Applicant:
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Inventor:
Shiro Harashima, Sagamihara, JP;
Assignee:
KABUSHIKI KAISHA TOSHIBA, Minato-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/60 (2006.01); H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/3121 (2013.01); H01L 24/06 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/0655 (2013.01); H01L 25/16 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/06537 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/14335 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3025 (2013.01);
Abstract
According to one embodiment, a memory module includes a substrate, a semiconductor memory device, a plate-form conductive member, wire, and a mold member. The substrate includes a ground terminal to which a ground potential is applied. The semiconductor memory device is provided on the substrate. The plate-form conductive member is provided on the semiconductor memory device. The wire that electrically connects the ground terminal to the plate-form conductive member. The mold member seals the semiconductor memory device on the substrate, the plate-form conductive member and the wire.