The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2016
Filed:
Jan. 16, 2013
Applicant:
Ams Ag, Unterpremstätten, AT;
Inventors:
Jochen Kraft, Oberaich, AT;
Jordi Teva, Eindhoven, NL;
Cathal Cassidy, Okinawa, JP;
Günther Koppitsch, Lieboch, AT;
Assignee:
ams AG, Unterpremstaetten, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 21/308 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 21/74 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/743 (2013.01); H01L 21/76877 (2013.01); H01L 21/76898 (2013.01); H01L 2224/02372 (2013.01);
Abstract
The semiconductor device comprises a substrate () of semiconductor material, a contact hole () reaching from a surface () into the substrate, and a contact metallization () arranged in the contact hole, so that the contact metallization forms an internal substrate contact () on the semiconductor material at least in a bottom area () of the contact hole.