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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9245832 B1

PDFFull Text
Date of Patent:
Jan. 26, 2016

Filed:

Oct. 10, 2014

Semiconductor module

Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, JP;

Inventors:

Akane Hasegawa, Kawasaki, JP;

Kenji Okamoto, Hachioji, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;

Attorney:

Rabin & Berdo, P.C.

Primary Examiner:

Hsien Ming Lee

Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/48 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 23/495 (2006.01); H01L 23/433 (2006.01); H01L 23/373 (2006.01); H01L 23/36 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 23/36 (2013.01); H01L 23/3731 (2013.01); H01L 23/4334 (2013.01); H01L 23/4952 (2013.01); H01L 23/49555 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 24/48 (2013.01); H01L 23/295 (2013.01); H01L 23/3107 (2013.01); H01L 23/3735 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/40 (2013.01); H01L 24/45 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/84 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/40249 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48249 (2013.01); H01L 2224/48747 (2013.01); H01L 2224/48847 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83065 (2013.01); H01L 2224/84447 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85447 (2013.01); H01L 2224/92246 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/014 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01);
Abstract

A semiconductor module includes: a metal block; an insulation layer for heat radiation formed by directly depositing a ceramic material on at least a first surface of the metal block; an insulation layer for a relay electrode formed by directly depositing a ceramic material on a part of a second surfaceof the metal block; a relay electrode formed by depositing a metal material on the upper surface of the insulation layer for the relay electrode; a circuit element bonded with the second surface of the metal block by solder; and an external lead terminal, wherein a bonding wire or a lead frame from the circuit element is bonded with the relay electrode, and the relay electrode and the external lead terminal are connected.

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