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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9245775 B1

PDFFull Text
Date of Patent:
Jan. 26, 2016

Filed:

Apr. 17, 2013

Heating device

Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventors:

Nobuyuki Kondo, Taketoyo, JP;

Morimichi Watanabe, Nagoya, JP;

Asumi Jindo, Okazaki, JP;

Yuji Katsuda, Tsushima, JP;

Yosuke Sato, Hashima, JP;

Yoshinori Isoda, Nagoya, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:

Burr & Brown, PLLC

Primary Examiner:

Shawntina Fuqua

Int. Cl.
CPC ...
H05B 3/06 (2006.01); H01L 21/67 (2006.01); C04B 35/581 (2006.01); H05B 1/00 (2006.01); B32B 18/00 (2006.01); H05B 3/28 (2006.01); H01L 21/683 (2006.01); C04B 35/58 (2006.01); C04B 35/626 (2006.01); C04B 35/645 (2006.01); C04B 37/00 (2006.01); C23C 14/34 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67 (2013.01); B32B 18/00 (2013.01); C04B 35/58 (2013.01); C04B 35/581 (2013.01); C04B 35/6261 (2013.01); C04B 35/62655 (2013.01); C04B 35/645 (2013.01); C04B 37/001 (2013.01); C04B 37/003 (2013.01); C23C 14/3414 (2013.01); H01L 21/6831 (2013.01); H05B 1/00 (2013.01); H05B 3/283 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3222 (2013.01); C04B 2235/3225 (2013.01); C04B 2235/3865 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/77 (2013.01); C04B 2235/80 (2013.01); C04B 2235/96 (2013.01); C04B 2235/9607 (2013.01); C04B 2237/08 (2013.01); C04B 2237/34 (2013.01); C04B 2237/343 (2013.01); C04B 2237/36 (2013.01); C04B 2237/366 (2013.01); C04B 2237/58 (2013.01); C04B 2237/704 (2013.01); C04B 2237/708 (2013.01); C04B 2237/72 (2013.01); Y10T 428/24942 (2015.01);
Abstract

A heating apparatusA includes a susceptor having a heating faceof heating a semiconductor. The susceptor includes a plate shaped main bodyand a surface corrosion resistant layerincluding the heating face. The surface corrosion resistant layeris made of a ceramic material comprising magnesium, aluminum, oxygen and nitrogen as main components. The ceramic material comprises a main phase comprising magnesium-aluminum oxynitride phase exhibiting an XRD peak at least in 2θ=47 to 50° by CuKα X-ray.

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