The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2016
Filed:
Sep. 12, 2013
Applied Materials, Inc., Santa Clara, CA (US);
Vincent Steffan Francischetti, Columbia Falls, MT (US);
Gregory J. Wilson, Kalispell, MT (US);
Kyle M. Hanson, Kalispell, MT (US);
Paul Wirth, Kalispell, MT (US);
Robert B. Moore, Lewistown, MT (US);
APPLIED Materials, Inc., Santa Clara, CA (US);
Abstract
An anneal module for annealing semiconductor material wafers and similar substrates reduces particle contamination and oxygen ingress while providing uniform heating including for 500° C. processes. The anneal module may include a process chamber formed in a metal body having internal cooling lines. A hot plate has a pedestal supported on a thermal choke on the body. A gas distributor in the lid over the hot plate flows gas uniformly over the wafer. A transfer mechanism moves a hoop to shift the wafer between the hot plate and a cold plate.