The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2016
Filed:
Feb. 07, 2014
Applicant:
E I Du Pont DE Nemours and Company, Wilmington, DE (US);
Inventors:
Jay Robert Dorfman, Durham, NC (US);
Vincenzo Arancio, Bristol, GB;
Assignee:
E I DU PONT DE NEMOURS AND COMPANY, Wilmington, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); H03K 17/00 (2006.01); B29C 51/14 (2006.01); H01H 1/029 (2006.01); H05K 1/09 (2006.01); H01B 3/18 (2006.01); C08K 3/08 (2006.01); C08L 71/00 (2006.01); C08L 75/04 (2006.01); H03K 17/96 (2006.01); H01G 4/008 (2006.01); H05K 1/03 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); C08K 3/08 (2013.01); C08L 71/00 (2013.01); C08L 75/04 (2013.01); H01B 3/18 (2013.01); H01H 1/029 (2013.01); H03K 17/962 (2013.01); H05K 1/095 (2013.01); H01G 4/008 (2013.01); H03K 2017/9602 (2013.01); H03K 2217/960755 (2013.01); H05K 1/0326 (2013.01); H05K 1/16 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/10053 (2013.01); H05K 2203/1327 (2013.01); Y10T 428/256 (2015.01); Y10T 428/31554 (2015.04); Y10T 428/31609 (2015.04);
Abstract
This invention is directed to a polymer thick film conductive composition that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.