The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2016
Filed:
Jul. 25, 2014
Sae Magnetics (H.k.) Ltd., Hong Kong, CN;
Natsuo Nishijima, Hong Kong, CN;
Jian Hui Huang, GuangDong, CN;
Hong Tao Ma, GuangDong, CN;
Huan Chao Liang, GuangDong, CN;
SAE MAGNETICS (H.K.) LTD., Hong Kong, CN;
Abstract
A surface forming method for electronic component includes: forming a body that has at least one waveguide, with two ends of the waveguide exposed on a front end surface and a back end surface of the body; forming a photoresist film to cover on the front end surface of the body; irradiating a light from the back end surface of the body to remove a part, of the photoresist film, that covers at least a part of an end surface of the waveguide, thereby forming an exposed area on the end surface of the waveguide; etching the exposed area of the waveguide to form a recess; and removing the photoresist film. The position and size of the pattern could be controlled accurately and efficiently, instead of inefficient complex procedures of alignment.