The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2016
Filed:
Jan. 27, 2015
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Min Jin Ko, Daejeon, KR;
Jae Ho Jung, Daejeon, KR;
Bum Gyu Choi, Daejeon, KR;
Dae Ho Kang, Daejeon, KR;
Min Kyoun Kim, Daejeon, KR;
Byung Kyu Cho, Daejeon, KR;
Assignee:
LG CHEM, LTD., Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
C08G 77/04 (2006.01); C09D 183/04 (2006.01); C08L 83/04 (2006.01); H01L 23/29 (2006.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
C09D 183/04 (2013.01); C08G 77/04 (2013.01); C08L 83/04 (2013.01); H01L 23/293 (2013.01); H01L 33/56 (2013.01); H01L 2924/0002 (2013.01);
Abstract
Provided are a curable composition and its use. The curable composition has excellent processability, workability and adhesiveness, exhibits excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and adhesiveness after curing, has long-lasting durability and reliability even under harsh conditions, and does not cause whitening or surface stickiness. The curable composition can be used as an encapsulant or adhesive material for an optical semiconductor such as an LED.