The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2016

Filed:

Dec. 12, 2013
Applicant:

Toray Industries, Inc., Chuo-ku, Tokyo, JP;

Inventors:

Maki Nagano, Nagoya, JP;

Nobuyuki Tomioka, Nagoya, JP;

Takayuki Imaoka, Ehime, JP;

Shiro Honda, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/04 (2006.01); B32B 27/38 (2006.01); C08L 63/00 (2006.01); C08L 63/02 (2006.01); C08G 59/42 (2006.01); C08G 59/50 (2006.01); C08G 59/68 (2006.01); C08J 5/24 (2006.01); C08L 53/02 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); B32B 27/04 (2013.01); B32B 27/38 (2013.01); C08G 59/4238 (2013.01); C08G 59/50 (2013.01); C08G 59/686 (2013.01); C08J 5/24 (2013.01); C08J 2363/00 (2013.01); C08L 53/02 (2013.01); Y10T 428/24994 (2015.04); Y10T 428/24995 (2015.04);
Abstract

An epoxy resin composition comprising an epoxy resin [A], an amine-based curing agent [B] and a block copolymer [C] as components, wherein the epoxy resin [A] contains [Aa] an epoxy resin having at least one structure selected from a condensed polycyclic structure, biphenyl structure and oxazolidone ring structure; [Ab] an epoxy resin selected from a polyfunctional amine type epoxy resin [Ab1] and a liquid bisphenol type epoxy resin [Ab2], and the block copolymer [C] is at least one block copolymer selected from the group consisting of S-B-M, B-M and M-B-M. The present invention provides an epoxy resin composition that can be cured to form a cured product excellent in heat resistance, elastic modulus and toughness.


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