The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2016
Filed:
Nov. 24, 2011
Wan-li Chuang, Taipei, TW;
Chien-min Chang, Taipei, TW;
Ju-chen Chiu, Taipei, TW;
Chih-hua Liu, Taipei, TW;
Tsung-sheng Chuang, Taipei, TW;
Wan-Li Chuang, Taipei, TW;
Chien-Min Chang, Taipei, TW;
Ju-Chen Chiu, Taipei, TW;
Chih-Hua Liu, Taipei, TW;
Tsung-Sheng Chuang, Taipei, TW;
COMPAL ELECTRONICS, INC., Taipei, TW;
Abstract
A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece, wherein a material of the adhesive layer includes thermosetting resin and radiationcurable resin. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process is performed on the adhesive layer by one of radiation-curing and thermal-curing. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process is performed on the adhesive layer by another one of radiation-curing and thermal-curing after the workpiece is punched. In addition, a workpiece with three-dimensional pattern is also provided.