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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9242442 B1

PDFFull Text
Date of Patent:
Jan. 26, 2016

Filed:

Jan. 13, 2011

Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus

Applicants:

Hiroyuki Kurimura, Shibukawa, JP;

Hayato Miyazaki, Shibukawa, JP;

Gosuke Nakajima, Shibukawa, JP;

Inventors:

Hiroyuki Kurimura, Shibukawa, JP;

Hayato Miyazaki, Shibukawa, JP;

Gosuke Nakajima, Shibukawa, JP;

Assignee:

DENKA COMPANY LIMITED, Tokyo, JP;

Attorney:

Stein IP, LLC

Primary Examiner:

Daniel McNally

Int. Cl.
CPC ...
B32B 37/02 (2006.01); B32B 37/12 (2006.01); B32B 38/18 (2006.01); B32B 43/00 (2006.01); B32B 17/10 (2006.01); B32B 38/00 (2006.01); B32B 37/24 (2006.01); G02F 1/13 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
B32B 37/12 (2013.01); B32B 17/10045 (2013.01); B32B 17/10706 (2013.01); B32B 17/10908 (2013.01); B32B 38/1858 (2013.01); B32B 43/006 (2013.01); B32B 37/1284 (2013.01); B32B 38/0004 (2013.01); B32B 2037/1253 (2013.01); B32B 2037/243 (2013.01); B32B 2038/1891 (2013.01); B32B 2307/414 (2013.01); B32B 2309/04 (2013.01); B32B 2309/12 (2013.01); B32B 2310/0831 (2013.01); B32B 2457/20 (2013.01); G02F 1/1303 (2013.01); G02F 2001/133331 (2013.01); G02F 2201/50 (2013.01); Y10T 156/1043 (2015.01);
Abstract

Provided is a method of manufacturing a translucent rigid substrate laminate to improve a positional precision. Further, a translucent rigid substrate bonding apparatus contributing to improvement of the positional precision while increasing production efficiency of a plate-shaped product is provided. In the method of manufacturing the translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent therebetween, the entire fixing agent interposed and spreading between both translucent rigid substrates is cured everytime the translucent rigid substrates are bonded.

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