The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2016
Filed:
Jun. 20, 2013
Kumi Kasei Co., Ltd., Tokyo, JP;
Ube Machinery Corporation, Ltd., Ube-shi, JP;
Kumi Kasei Co., Ltd., , JP;
Abstract
A resin injection molding method of molding a resin by injection-filling an inside of a mold cavity formed by mold-clamping a pair of a design surface mold and a non-design surface mold, with a melted thermoplastic polypropylene resin composition, the method including: setting a temperature of each cavity-forming surface of the design surface mold and the non-design surface mold prior to the injection filling to 60° C. to 120° C., with the temperature of the cavity-forming surface of the design surface mold being 5° C. to 50° C. higher than the temperature of the cavity-forming surface of the non-design surface mold; and causing the resin pressure to reach a negative pressure within 7 seconds after injection filling is complete, wherein the thermoplastic polypropylene resin composition contains a crystalline polypropylene resin and a rubber component and a content of the rubber component is 1 mass % to 40 mass %.