The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2016

Filed:

Oct. 07, 2009
Applicant:

Andrew Leo Haynes, Auckland, NZ;

Inventors:

Andrew Leo Haynes, Auckland, NZ;

Christopher John Nicholls, Auckland, NZ;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 43/44 (2006.01); B29C 43/22 (2006.01); B29C 43/30 (2006.01); B29C 47/88 (2006.01); B29C 47/00 (2006.01); B29C 47/06 (2006.01); B29C 47/14 (2006.01); B29C 43/02 (2006.01);
U.S. Cl.
CPC ...
B29C 43/222 (2013.01); B29C 43/305 (2013.01); B29C 47/0038 (2013.01); B29C 47/885 (2013.01); B29C 47/0019 (2013.01); B29C 47/0021 (2013.01); B29C 47/0033 (2013.01); B29C 47/0047 (2013.01); B29C 47/0054 (2013.01); B29C 47/065 (2013.01); B29C 47/145 (2013.01); B29C 2043/025 (2013.01); B29K 2995/0072 (2013.01); Y10T 428/24355 (2015.01);
Abstract

This invention relates to methods for forming polymer(s) including heating of a polymer to be formed to a temperature above its glass transition temperature, continuously depositing (preferably by flowing or laying) the polymer onto a moulding surface (herein the 'lower moulding surface') of a first mould, (preferably in a manner that reduces, eliminates or minimises shear stress or other stress in the polymer so deposited), the polymer remaining above the glass transition temperature, applying a moulding surface (herein the 'upper surface') of the polymer while the polymer remains at a temperature above the glass transition temperature, and allowing the polymer to transition to below the glass transition temperature while within or between the upper and lower moulding surfaces, wherein the polymer is removed from the moulding surfaces. Apparatus is also provided.


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