The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2016
Filed:
May. 02, 2013
Applicant:
Memc Singapore Pte. Ltd., Singapore, SG;
Inventors:
James A. Hicks, Foley, MO (US);
Nicholas R. Mercurio, O'Fallon, MO (US);
Assignee:
MEMC Singapore Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C01B 33/02 (2006.01); B32B 27/32 (2006.01); B32B 9/04 (2006.01); B32B 13/04 (2006.01); B21C 1/00 (2006.01); B24B 9/06 (2006.01); C30B 29/06 (2006.01); C30B 33/00 (2006.01);
U.S. Cl.
CPC ...
B24B 9/06 (2013.01); C01B 33/02 (2013.01); C30B 29/06 (2013.01); C30B 33/00 (2013.01); Y10T 428/12236 (2015.01); Y10T 428/12285 (2015.01);
Abstract
A method of grinding an ingot for use in manufacturing a semiconductor or solar wafer is disclosed. The method includes providing an ingot including four flat sides and four rounded corner portions, each corner portion extending between an adjacent pair of the flat sides, and grinding a plurality of planar facets on each corner portion, each planar facet of the corner portion joined to an adjacent facet at a juncture and oriented such that each corner portion has a substantially arcuate shape. A wafer and ingot are also disclosed.