The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2016

Filed:

May. 22, 2012
Applicants:

Yujiro Kaneko, Hitachinaka, JP;

Tokihito Suwa, Hitachinaka, JP;

Shinji Hiramitsu, Tokyo, JP;

Takahiro Shimura, Hitachinaka, JP;

Inventors:

Yujiro Kaneko, Hitachinaka, JP;

Tokihito Suwa, Hitachinaka, JP;

Shinji Hiramitsu, Tokyo, JP;

Takahiro Shimura, Hitachinaka, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H02M 7/00 (2006.01); B60L 11/14 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); B60L 11/14 (2013.01); H02M 7/003 (2013.01); H05K 7/20909 (2013.01); B60L 2200/26 (2013.01); B60L 2210/40 (2013.01); Y02T 10/70 (2013.01); Y02T 10/7077 (2013.01); Y02T 10/7241 (2013.01);
Abstract

A power module includes a plurality of semiconductor devices constituting upper/lower arms of an inverter circuit, a plurality of conductive plates arranged to face electrode surfaces of the semiconductor devices and a module case configured to accommodate the semiconductor devices and conductive plates, wherein the module case includes a heat-radiation member made of plate-like metal and facing a surface of the conductive plate and a metallic frame body having an opening that is closed by the heat-radiation member, and wherein a heat-radiation fin unit having a plurality of heat-radiation fins vertically arranged thereon is provided at a center of the heat-radiation member, and a joint portion with the frame body is provided at an peripheral edge of the heat-radiation member, and the heat radiation member has a heat conductivity higher than that of the frame body, and the frame body has a higher rigidity than that of the heat-radiation member.


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