The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2016

Filed:

Jul. 31, 2013
Applicant:

Futurewei Technologies, Inc., Plano, TX (US);

Inventors:

Vadim Gektin, San Jose, CA (US);

Jiye Xu, Santa Clara, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 7/14 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/1489 (2013.01); H05K 7/1452 (2013.01); H05K 7/1487 (2013.01); H05K 7/20727 (2013.01); H05K 7/20754 (2013.01);
Abstract

The thermal efficiency of dual-column chassis can be improved by re-locating line card to connection plane (LC-to-CP) interfaces to the center of the connection plane, as this allows inter line card channels (inter-LC channels) to be routed in a manner that avoids bisecting the thermal throughways over which convection cooling air is circulated to the line cards. One technique for centrally locating the LC-to-CP interfaces on the connection plane is to invert one column of line cards. Another technique for centrally locating the LC-to-CP interfaces on the connection plane is to use non-uniform line cards. An additional benefit of centrally locating the LC-to-CP interfaces on the connection plane is that the inter-LC channels extending between perpendicularly adjacent line cards are shortened, which increases server performance by virtue of reducing switching latency.


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