The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2016
Filed:
Jul. 10, 2013
Applicant:
AU Optronics Corp., Hsin-Chu, TW;
Inventors:
Assignee:
AU OPTRONICS CORP., Hsin-Chu, TW;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); G02F 1/1345 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/36 (2006.01); H05K 3/40 (2006.01); H05K 3/24 (2006.01); H01R 9/00 (2006.01); H05K 7/00 (2006.01); H05K 1/00 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 1/112 (2013.01); G02F 1/1345 (2013.01); G02F 1/13458 (2013.01); H05K 1/0277 (2013.01); H05K 3/244 (2013.01); H05K 3/361 (2013.01); H05K 3/365 (2013.01); H05K 3/368 (2013.01); H05K 3/4007 (2013.01); H05K 3/4015 (2013.01); H05K 3/4038 (2013.01); H05K 3/4046 (2013.01); H05K 3/4053 (2013.01); H05K 3/4076 (2013.01); H05K 1/111 (2013.01); H05K 1/189 (2013.01); H05K 3/323 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/10128 (2013.01);
Abstract
An electronic assembly includes a first substrate, at least one first conductive pad and multiple second conductive pads. The first substrate comprises a base layer and at least one conductive circuit layer. The at least one conductive circuit layer is disposed on the base layer. The at least one first conductive pad is disposed on the first substrate. The first conductive pad is electrically insulated from the conductive circuit layer. The first conductive pad includes multiple first holes. The second conductive pads are disposed on the first substrate. The second conductive pads are electrically connected to the conductive circuit layer.