The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2016

Filed:

Nov. 26, 2013
Applicant:

Commissariat a L'energie Atomique ET Aux Ene Alt, Paris, FR;

Inventor:

Gabriel Pares, Bernin, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); H01L 21/563 (2013.01); H01L 23/3171 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H05K 3/4084 (2013.01); H05K 3/467 (2013.01); H01L 23/49811 (2013.01); H01L 24/11 (2013.01); H01L 2224/0215 (2013.01); H01L 2224/02123 (2013.01); H01L 2224/02141 (2013.01); H01L 2224/02166 (2013.01); H01L 2224/036 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0348 (2013.01); H01L 2224/0381 (2013.01); H01L 2224/0391 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05187 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05559 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05584 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/10126 (2013.01); H01L 2224/10135 (2013.01); H01L 2224/1148 (2013.01); H01L 2224/1181 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11464 (2013.01); H01L 2224/13006 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13084 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13166 (2013.01); H01L 2224/16111 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/3201 (2013.01); H01L 2224/73103 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81007 (2013.01); H01L 2224/81011 (2013.01); H01L 2224/8114 (2013.01); H01L 2224/81139 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83102 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/9211 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06593 (2013.01); H01L 2924/00014 (2013.01);
Abstract

Forming of a microelectronic device including a substrate containing at least one conductive pad, the pad being provided with a bottom surface resting on the substrate and an upper surface opposite the bottom surface. The upper surface of the pad has a stack applied thereto formed of a conductive layer and a protective dielectric layer including an opening called first opening facing the pad and exposing the conductive layer. At least one insulating block is arranged on a peripheral region of the upper surface of the pad, the insulating block having a cross-section forming a closed contour and having an opening called second opening. A conductive pillar is located in the center of the contour in the second opening.


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