The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2016

Filed:

Dec. 23, 2014
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Sang In Yoon, Seoul, KR;

Jeong Han Kim, Seoul, KR;

Jeung Ook Park, Seoul, KR;

Hyun Gu Im, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 33/62 (2010.01); H05K 1/09 (2006.01); H05K 1/05 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0201 (2013.01); H01L 33/62 (2013.01); H05K 1/05 (2013.01); H05K 1/09 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01); H05K 1/053 (2013.01); H05K 1/056 (2013.01); H05K 3/243 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A printed circuit board according to an embodiment of the present invention includes a substrate including a first metal layer, a second metal layer formed on one surface of the first metal layer, and a third metal layer formed on the other surface of the first metal layer, an insulating layer formed on the second metal layer, and a circuit pattern formed on the insulating layer. A cavity configured to accommodate a light emitting element package is formed in the insulating layer. A thermal conductivity of the first metal layer is greater than thermal conductivities of the second metal layer and the third metal layer.


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