The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2016

Filed:

Sep. 14, 2012
Applicants:

Yujiro Tajima, Yokohama, JP;

Tomoko Ota, Yokohama, JP;

Junichi Shibuya, Yokohama, JP;

Koichi Nakayama, Musashino, JP;

Takeshi Yoshiyuki, Yokohama, JP;

Yuji Nobusada, Yokohama, JP;

Inventors:

Yujiro Tajima, Yokohama, JP;

Tomoko Ota, Yokohama, JP;

Junichi Shibuya, Yokohama, JP;

Koichi Nakayama, Musashino, JP;

Takeshi Yoshiyuki, Yokohama, JP;

Yuji Nobusada, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 3/15 (2006.01); H05H 7/20 (2006.01); B22F 5/06 (2006.01); B21C 37/06 (2006.01); B30B 11/00 (2006.01); B22F 5/10 (2006.01);
U.S. Cl.
CPC ...
H05H 7/20 (2013.01); B21C 37/06 (2013.01); B22F 5/06 (2013.01); B30B 11/001 (2013.01); B22F 2005/103 (2013.01);
Abstract

According to one embodiment, there is provided a method of manufacturing a high-frequency acceleration cavity component, the method including covering a mold with a conducting material, enclosing, in an outer shell, the mold covered with the conducting material, vacuum-airtight-welding the outer shell enclosing the mold, conducing hot isostatic pressing of the vacuum-airtight-welded outer shell, and taking the conducting material formed in the mold out of the outer shell which has undergone the hot isostatic pressing.


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