The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2016
Filed:
Nov. 07, 2013
Applicant:
Toyoda Gosei Co., Ltd., Kiyosu-shi, JP;
Inventors:
Assignee:
TOYODA GOSEI CO., LTD., Kiyosu-shi, Aichi-Ken, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 29/267 (2006.01); H01L 31/12 (2006.01); H01L 33/00 (2010.01); H01L 31/0203 (2014.01); H01L 23/28 (2006.01); H01L 23/29 (2006.01); H01L 33/64 (2010.01); H01L 33/44 (2010.01); H01L 33/48 (2010.01); H01L 21/673 (2006.01); H01L 33/52 (2010.01); H01L 23/02 (2006.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 33/641 (2013.01); H01L 21/67376 (2013.01); H01L 23/02 (2013.01); H01L 23/28 (2013.01); H01L 31/0203 (2013.01); H01L 33/44 (2013.01); H01L 33/48 (2013.01); H01L 33/483 (2013.01); H01L 33/52 (2013.01); H01L 33/56 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/181 (2013.01); H01L 2924/183 (2013.01); H01L 2924/186 (2013.01);
Abstract
The present invention provides a light emitting device, which includes a light emitting diode (LED) chip, a case formed of polycyclohexylene dimethylene terephthalate, and a sealant that is charged into the case to seal the LED chip. In the light emitting device, a stabilizer having a melting point that is higher than a junction temperature of the LED chip by 80° C. or more exists at a boundary surface between an inner wall surface of the case and the sealant or within 300 μm of the boundary surface.