The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2016

Filed:

Sep. 05, 2014
Applicant:

Advanced Photonics, Inc., Ota-Ku, Tokyo, JP;

Inventors:

Xueliang Song, Ota-Ku, JP;

Foo Cheong Yit, Ota-ku, JP;

Katsumasa Horiguchi, Ota-ku, JP;

Shurong Wang, Ota-ku, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); G02B 6/42 (2006.01); H01L 33/54 (2010.01); H01S 5/022 (2006.01); H01L 31/0203 (2014.01); H01L 31/18 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); G02B 6/4201 (2013.01); H01L 31/0203 (2013.01); H01L 31/18 (2013.01); H01L 33/54 (2013.01); H01S 5/02236 (2013.01); H01S 5/02284 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/3011 (2013.01); H01L 2933/0033 (2013.01); H01S 5/02248 (2013.01); Y10T 156/1052 (2015.01); Y10T 156/1082 (2015.01);
Abstract

In manufacturing a submount, a first electrode layer () is formed as a layer on the surface of a submount substrate (); a side surface () of the first electrode layer () is formed on substantially the same plane as a side surface () of the submount substrate (); and the side surface () of the first electrode layer () is a connection surface for creating an electrical connection with the first electrode layer (). By making the first electrode layer () sufficiently thick, the surface area of the side surface () can be made sufficiently large to allow, for example, wire bonding using the side surface (). Further, components such as an optical element () can be protected by a sealing material ().


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