The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2016
Filed:
Oct. 09, 2013
Applicant:
Robert Bosch Gmbh, Stuttgart, DE;
Inventors:
Gregor Schuermann, Reutlingen, DE;
Hubert Benzel, Pliezhausen, DE;
Assignee:
ROBERT BOSCH GMBH, Stuttgart, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 27/08 (2006.01); H01L 27/14 (2006.01); H01L 21/00 (2006.01); G01J 5/00 (2006.01); H01L 29/66 (2006.01); H01L 27/146 (2006.01); G01J 5/08 (2006.01); H01L 21/762 (2006.01); G01J 5/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0814 (2013.01); G01J 5/00 (2013.01); G01J 5/024 (2013.01); G01J 5/0225 (2013.01); G01J 5/0853 (2013.01); H01L 21/00 (2013.01); H01L 21/76229 (2013.01); H01L 21/76289 (2013.01); H01L 25/00 (2013.01); H01L 27/14 (2013.01); H01L 27/14649 (2013.01); H01L 29/66136 (2013.01);
Abstract
An integrated diode array and a corresponding manufacturing method are provided. The integrated diode array includes a substrate having an upper side, and a plurality of blocks of several diodes, which are positioned in a planar manner and are suspended at the substrate above a cavity situated below them in the substrate. The blocks are separated from one another by respective gaps, and within a specific block, the individual diodes are electrically insulated from one another by first STI trenches situated between them.