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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9240389 B1

PDFFull Text
Date of Patent:
Jan. 19, 2016

Filed:

Mar. 20, 2013

Method for producing at least one pad assembly on a support for the self-assembly of an integrated circuit chip on the support by the formation of a fluorinated material surrounding the pad and exposure of the pad and the fluorinated material to an ultraviolet treatment in the presence of ozone

Applicants:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Stmicroelectronics (Crolles 2) Sas, Crolles, FR;

Inventors:

Léa Di Cioccio, Saint Ismier, FR;

Sébastien Mermoz, Meylan, FR;

Loïc Sanchez, Voiron, FR;

Assignees:

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, Paris, FR;

STMICROELECTRONICS (CROLLES2) SAS, Crolles, FR;

Attorney:

Vedder Price, P.C.

Primary Examiner:

Sheila V Clark

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 21/311 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 21/311 (2013.01); H01L 23/147 (2013.01);
Abstract

A method for producing at least one pad assembly () on a support () for use in a method for self-assembling at least one element () on the support (), comprises fanning, on the support (), a layer () of at least one fluorinated material around the location () of the pad assembly (), the layer () having a thickness greater than 10 nm. The layer () and the location () are exposed to an ultraviolet treatment in the presence of ozone to form the pad assembly () at said location (), wherein a drop of liquid () having a static contact angle on the pad assembly () less than or equal to 15°, after the exposure to the ultraviolet treatment, has a static contact angle on the layer () greater than or equal to 100°.

Find Patent Forward Citations

Di Cioccio, Léa. (2016). Method for producing at least one pad assembly on a support for the self-assembly of an integrated circuit chip on the support by the formation of a fluorinated material surrounding the pad and exposure of the pad and the fluorinated material to an ultraviolet treatment in the presence of ozone (U.S. Patent No. 9240389). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9240389

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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