The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2016
Filed:
Jan. 30, 2014
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Jeong-Gi Jin, Osan-si, KR;
Ho-Joon Lee, Seoul, KR;
Ji-Woong Sue, Yongin-si, KR;
Joo-Hee Jang, Hwaseong-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
Provided are a semiconductor device, a semiconductor package, and an electronic system. The device includes a substrate having a front side and a back side disposed opposite the front side. An internal circuit is disposed on or near to the front side of the substrate. Signal I/O through-via structures are disposed in the substrate. Back side conductive patterns are disposed on the back side of the substrate and electrically connected to the signal I/O through-via structures. A back side conductive structure is disposed on the back side of the substrate and spaced apart from the signal I/O through-via structures. The back side conductive structure includes parallel supporter portions.