The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2016
Filed:
Mar. 10, 2014
Baek Soung Park, Uiwang-si, KR;
Jae Won Choi, Uiwang-si, KR;
IN Hwan Kim, Uiwang-si, KR;
Gyu Seok Song, Uiwang-si, KR;
Su MI Lim, Uiwang-si, KR;
Baek Soung Park, Uiwang-si, KR;
Jae Won Choi, Uiwang-si, KR;
In Hwan Kim, Uiwang-si, KR;
Gyu Seok Song, Uiwang-si, KR;
Su Mi Lim, Uiwang-si, KR;
CHEIL INDUSTRIES, INC., Gumi-si, Gyeongsangbuk-do, KR;
Abstract
A heat dissipation adhesive film, a semiconductor device including the same, and a method of fabricating the semiconductor device, the heat dissipation adhesive film being placeable between a protective layer encasing a semiconductor element therein and a heat dissipation metal layer on the protective layer to bond the protective layer to the heat dissipation metal layer, wherein an adhesive strength between the heat dissipation adhesive film and the protective layer and an adhesive strength between the heat dissipation adhesive film and the heat dissipation metal layer are each about 3 kgf/25 mmor greater.