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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9240333 B1

PDFFull Text
Date of Patent:
Jan. 19, 2016

Filed:

Aug. 08, 2014

Manufacturing method for monolithic ceramic electronic component

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Togo Matsui, Nagaokakyo, JP;

Minoru Dooka, Nagaokakyo, JP;

Hiroyoshi Takashima, Nagaokakyo, JP;

Kenichi Okajima, Nagaokakyo, JP;

Assignee:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Alex Efta

Int. Cl.
CPC ...
C03B 29/00 (2006.01); B44C 1/165 (2006.01); B44C 1/17 (2006.01); H01L 21/64 (2006.01); C04B 37/00 (2006.01); H01G 4/06 (2006.01); B32B 38/04 (2006.01); B32B 37/02 (2006.01); B32B 37/12 (2006.01); B32B 37/16 (2006.01); B26D 1/04 (2006.01); H01G 4/12 (2006.01); H01G 13/00 (2013.01); H05K 3/00 (2006.01); B32B 37/10 (2006.01); B32B 37/00 (2006.01); C04B 35/00 (2006.01); C04B 35/468 (2006.01); H01G 4/30 (2006.01); B32B 38/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/64 (2013.01); B26D 1/04 (2013.01); B32B 37/02 (2013.01); B32B 37/12 (2013.01); B32B 37/16 (2013.01); B32B 38/04 (2013.01); C04B 37/00 (2013.01); H01G 4/06 (2013.01); H01G 4/12 (2013.01); H01G 4/30 (2013.01); H01G 13/00 (2013.01); H05K 3/0058 (2013.01); B32B 37/00 (2013.01); B32B 37/10 (2013.01); B32B 38/0004 (2013.01); B32B 2038/042 (2013.01); C04B 35/00 (2013.01); C04B 35/468 (2013.01); C04B 37/006 (2013.01); C04B 2237/12 (2013.01); C04B 2237/32 (2013.01); H01G 4/308 (2013.01); Y10T 156/1052 (2015.01); Y10T 156/1348 (2015.01);
Abstract

In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.

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