The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2016

Filed:

Oct. 23, 2013
Applicant:

Peter Heimlicher, Fribourg, CH;

Inventor:

Peter Heimlicher, Fribourg, CH;

Assignee:

OPTOSYS SA, , CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 27/28 (2006.01); G01B 7/14 (2006.01); H03K 17/95 (2006.01); G01D 11/24 (2006.01); H01L 23/047 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
G01B 7/14 (2013.01); G01D 11/245 (2013.01); H03K 17/9505 (2013.01); H01L 23/047 (2013.01); H01L 23/3135 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/49171 (2013.01);
Abstract

The present disclosure relates to a proximity sensor having a coil () for generating a magnetic field and a sensor circuit () for detecting variations of the magnetic field caused by an external object, the sensor circuit () comprising at least one semiconductor component () mounted on a circuit board (), wherein the coil () and the circuit board () are arranged in a housing () through which the magnetic field is transmittable. In order to improve the resistance of the proximity sensor against harmful external influences, such as high temperatures, and to prolong its life cycle, the invention suggests that the semiconductor component () is included in an enclosure () that is hermetically sealed and fixed on a surface () of the circuit board ().


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