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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9238733 B1

PDFFull Text
Date of Patent:
Jan. 19, 2016

Filed:

Nov. 16, 2012

Halogen-free resin composition

Applicant:

Elite Electronic Material (Zhongshan) Co., Ltd, ZhongShan, Guangdong Province, CN;

Inventors:

Chang-Yuan Li, ZhongShan, CN;

Li-Ming Chou, Tao-Yuan Hsien, TW;

Li-Chih Yu, Tao-Yuan Hsien, TW;

Tse-An Lee, Tao-Yuan Hsien, TW;

Assignee:

ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD., Guangdong Province, CN;

Attorneys:

WPAT, P.C.

Anthony King

Primary Examiner:

Coris Fung

Int. Cl.
CPC ...
B32B 27/38 (2006.01); C08L 63/00 (2006.01); C08L 37/00 (2006.01); B32B 15/092 (2006.01); B32B 3/10 (2006.01); C08L 65/00 (2006.01); B32B 5/02 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); C08J 5/24 (2006.01); C08L 79/02 (2006.01); C08G 73/02 (2006.01); C08L 61/00 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); B32B 3/10 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 15/092 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C08J 5/24 (2013.01); C08L 37/00 (2013.01); C08L 65/00 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2307/204 (2013.01); B32B 2307/306 (2013.01); B32B 2307/3065 (2013.01); B32B 2457/08 (2013.01); C08G 73/0233 (2013.01); C08J 2363/00 (2013.01); C08L 61/00 (2013.01); C08L 79/02 (2013.01); C08L 2205/035 (2013.01); H05K 1/0353 (2013.01); H05K 1/0373 (2013.01); H05K 2201/0209 (2013.01); Y10T 428/24917 (2015.01); Y10T 428/31529 (2015.04);
Abstract

A halogen-free resin composition includes 100 parts by weight of epoxy resin; 10 to 100 parts by weight of benzoxazine resin; 10 to 100 parts by weight of styrene-maleic anhydride copolymer; and 10 to 90 parts by weight of dicyclopentadiene phenol novolac resin. The halogen-free resin composition features specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dielectric dissipation factor, high heat resistance and high non-flammability and produce prepregs or resin film, and is thus applicable to copper clad laminates and printed circuit boards.

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