The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2016
Filed:
Nov. 05, 2010
Molded product, clothing, production process for laminate, and production process for molded product
Applicants:
Yosuke Noda, Yokohama, JP;
Kazuhiro Tsuchiya, Komaki, JP;
Yasuyuki Kabeya, Komaki, JP;
Inventors:
Assignee:
BRIDGESTONE CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 1/00 (2006.01); B32B 3/24 (2006.01); B32B 3/26 (2006.01); B32B 5/04 (2006.01); B32B 5/20 (2006.01); B32B 5/22 (2006.01); A41C 3/14 (2006.01); A41D 27/28 (2006.01); A41D 31/02 (2006.01); B29C 51/14 (2006.01); B32B 5/18 (2006.01); B32B 5/24 (2006.01); B32B 38/00 (2006.01); B32B 37/12 (2006.01); B32B 38/04 (2006.01); B29D 99/00 (2010.01); B29K 105/04 (2006.01); A41C 3/00 (2006.01);
U.S. Cl.
CPC ...
B32B 3/266 (2013.01); A41C 3/144 (2013.01); B29C 51/14 (2013.01); B32B 3/263 (2013.01); B32B 5/04 (2013.01); B32B 5/18 (2013.01); B32B 5/245 (2013.01); A41C 3/00 (2013.01); A41D 27/28 (2013.01); A41D 31/02 (2013.01); A41D 2400/20 (2013.01); B29C 51/145 (2013.01); B29D 99/0064 (2013.01); B29K 2105/04 (2013.01); B32B 1/00 (2013.01); B32B 37/12 (2013.01); B32B 38/0004 (2013.01); B32B 2038/045 (2013.01); B32B 2266/0278 (2013.01); B32B 2437/00 (2013.01); Y10T 428/24628 (2015.01);
Abstract
A molded product obtained by molding a laminate which comprises a stretchable substrate made of a sheet-shaped synthetic resin foam and including multiple slits, and a stretchable surfacing material affixed to at least one surface of the substrate, wherein the substrate is bonded to the surfacing material in a state that at least some of the slits are kept opened.