The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2016
Filed:
Jun. 29, 2011
Soichi Ishibashi, Nagoya, JP;
Kazuaki Funada, Tokyo, JP;
Shinya Takeuchi, Otsu, JP;
Tamotsu Suzuki, Otsu, JP;
Rinako Eto, Nagoya, JP;
Masayoshi Morihara, Nagoya, JP;
Takeru Sasaki, Nagoya, JP;
Eisuke Wadahara, Nagoya, JP;
Yasumoto Noguchi, Otsu, JP;
Soichi Ishibashi, Nagoya, JP;
Kazuaki Funada, Tokyo, JP;
Shinya Takeuchi, Otsu, JP;
Tamotsu Suzuki, Otsu, JP;
Rinako Eto, Nagoya, JP;
Masayoshi Morihara, Nagoya, JP;
Takeru Sasaki, Nagoya, JP;
Eisuke Wadahara, Nagoya, JP;
Yasumoto Noguchi, Otsu, JP;
Toray Industries, Inc., , JP;
Abstract
A process for producing a sheet-shaped prepreg includes: a fiber bundle introduction step in which tape-shaped reinforcing fiber bundles are disposed in a multilayer arrangement in the thickness direction and introduced into a die to which a molten thermoplastic resin has been supplied; a fiber bundle thickness reduction step in which each of the tape-shaped reinforcing fiber bundles is widened by means of spreading to reduce the thickness; a resin impregnation step in which the tape-shaped reinforcing fiber bundles are impregnated with the molten resin in the die; and a lamination step in which the plurality of resin-impregnated tape-shaped reinforcing fiber bundles are laminated in the die.