The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2016
Filed:
Oct. 25, 2011
Kanji Sekihara, Toyokawa, JP;
Kanji Sekihara, Toyokawa, JP;
WAKO PURE CHEMICAL INDUSTRIES, LTD., Osaka, JP;
KONICA MINOLTA, INC., Tokyo, JP;
Abstract
A molding die for molding a substrate to be included in a microchip includes a first die and a second die contactable with and separable from the first die. One of the first die and the second die includes a ridge for molding the groove and a columnar first protrusion for molding at least a smallest diameter portion of a hole in the substrate, the portion having the smallest inner diameter. The other of the first die and the second die includes a second protrusion which is formed to be columnar having a diameter larger than the diameter of the first protrusion and contacts with a distal end of the first protrusion to mold the hole so as to extend through the substrate in cooperation with the first protrusion. A microchip also is provided.