The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2016

Filed:

Jan. 16, 2014
Applicant:

Lextar Electronics Corporation, Hsinchu, TW;

Inventors:

Shing-Kuo Chen, Taipei, TW;

Bo-Yu Ko, New Taipei, TW;

Hsiu-Hsiang Lin, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/02 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); B29C 45/14 (2006.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
B29C 45/02 (2013.01); B29C 45/14655 (2013.01); H01L 33/483 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 33/60 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01);
Abstract

An LED mounting substrate includes a lead frame, a base, and a residue of injection molding material. The base is placed on the lead frame, and includes a cavity. The bottom of the cavity includes an opening for exposing portion of the lead frame. The cross-sectional area of the cavity increases along the direction from the lead frame to the top surface of the base. The residue of injection molding material is remained on one of outer walls of the base surrounding the cavity. The cross-sectional area of the residue of injection molding material decreases along the direction from the lead frame to the top surface of the base.


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