The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2016

Filed:

Mar. 12, 2014
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon, KR;

Inventors:

Hong-Won Kim, Suwon, KR;

Keun-Yong Lee, Suwon, KR;

Young-Do Kweon, Suwon, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H05K 3/4602 (2013.01); H05K 2201/10522 (2013.01);
Abstract

An electronic component embedded substrate is disclosed. The electronic component embedded substrate in accordance with an embodiment of the present invention includes: a core substrate having a cavity formed therein; a plurality of electronic components embedded in the cavity and arranged in a predetermined format; and a plurality of dielectric spacers interposed in between the plurality of electronic components that are adjacent to one another in the cavity.


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