The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2016
Filed:
Aug. 30, 2013
Applicant:
Daikin Industries, Ltd., Osaka-shi, Osaka, JP;
Inventors:
Assignee:
DAIKIN INDUSTRIES, LTD., Osaka-Shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 7/00 (2006.01); H05K 1/18 (2006.01); G01R 1/20 (2006.01); H01C 13/00 (2006.01); H02P 6/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H01C 1/084 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); G01R 1/203 (2013.01); H01C 13/00 (2013.01); H02P 6/002 (2013.01); H05K 1/0296 (2013.01); H05K 1/11 (2013.01); H01C 1/084 (2013.01); H05K 2201/10022 (2013.01);
Abstract
For an electronic circuit apparatus including a shunt resistor, provided is a measure for improving the heat dissipation performance of the shunt resistor. The shunt resistor includes electrodes at both ends. One of the two electrodes is connected to a surface-mounting pattern on which the shunt resistor is surface-mounted. A current-generating-side pattern and a current-receiving-side pattern are arranged separately from the surface-mounting pattern. The current-generating-side pattern and the surface-mounting pattern are connected together via a connection member which creates a space between itself and a substrate.