The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2016

Filed:

Mar. 26, 2014
Applicant:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Inventors:

Cristiano Gianluca Stella, San Gregorio di Catania, IT;

Rosalba Cacciola, Tremestrieri Etneo, IT;

Giuseppe Luigi Malgioglio, Catania, IT;

Assignee:

STMicroelectronics S.r.l., Agrate Brianza (MB), IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); H05K 1/02 (2006.01); B23K 1/08 (2006.01); B23K 1/00 (2006.01); H01L 23/367 (2006.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); B23K 1/0016 (2013.01); B23K 1/085 (2013.01); H01L 23/3677 (2013.01); H05K 13/0465 (2013.01); H01L 2224/13 (2013.01); H01L 2924/13091 (2013.01); H05K 2201/066 (2013.01);
Abstract

An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder paste is applied to the second surface. The solder paste penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to weld a thermal radiator and/or electronic contact of the electronic device to the vias. The solder paste further remains in the cavity to form a corresponding heat sink.


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