The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2016
Filed:
Feb. 15, 2012
Christian Djonga, Heilbronn, DE;
Stefan Gaab, Ludwigsburg, DE;
Tobias Werner, Fellbach, DE;
Michele Hirsch, Esslingen, DE;
Michael Heeb, Stuttgart, DE;
Markus Kretschmer, Pleidelsheim, DE;
Torsten Heidrich, Vaihingen/Enz, DE;
Christian Djonga, Heilbronn, DE;
Stefan Gaab, Ludwigsburg, DE;
Tobias Werner, Fellbach, DE;
Michele Hirsch, Esslingen, DE;
Michael Heeb, Stuttgart, DE;
Markus Kretschmer, Pleidelsheim, DE;
Torsten Heidrich, Vaihingen/Enz, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
The invention relates to a method for operating an electrical machine () controlled by an inverter (), wherein the inverter () comprises half-bridge branches (-U,-V,-W) having power components in the form of controllable power switching elements () and power diodes () respectively connected in parallel therewith, wherein each of the half-bridge branches (-U;-V;-W) is arranged on a separate semiconductor module (-U;-V;-W), which are arranged jointly on a baseplate (), wherein the phase currents (1_U, 1_V, 1_W) flowing through the half-bridge branches (-U,-V,-W), the voltages present at the power components and temperatures (t_Sens_U, t_Sens_V, t_Sens_W) on the semiconductor modules (-U,-V,-W) are determined, from the current (1_U; 1_V; 1_W) respectively flowing at a power component and from the voltage respectively present a power loss (P) is calculated for each of the power components, from the power losses (P) a relevant temperature swing (Δt; Δt_Sens) is determined for each of the power components and for temperature sensors (-U,-V,-W) serving to determine the temperatures on the semiconductor modules, a temperature (TempCooler) of the baseplate () is determined from the determined temperatures (t_Sens_U, t_Sens_V, t_Sens_W) on the semiconductor modules (--V,-W) and the determined temperature swings (Δt_Sens) at the temperature sensors (-U,-V,-W), and a torque or a power of the electrical machine () is determined in a manner dependent on the determined temperature swings (Δt) and the determined temperature (TempCooler) of the baseplate ().