The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2016

Filed:

Mar. 13, 2013
Applicant:

Nihon Dempa Kogyo Co., Ltd., Tokyo, JP;

Inventors:

Taichi Hayasaka, Saitama, JP;

Shuichi Mizusawa, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/29 (2013.01); H01L 41/08 (2006.01); H03H 9/10 (2006.01); H01L 23/00 (2006.01); H03H 9/13 (2006.01); H03H 3/02 (2006.01); H03H 9/05 (2006.01);
U.S. Cl.
CPC ...
H01L 41/0805 (2013.01); H01L 24/97 (2013.01); H01L 41/29 (2013.01); H03H 9/1021 (2013.01); H03H 9/1035 (2013.01); H01L 2224/16225 (2013.01); H03H 9/0547 (2013.01); H03H 9/131 (2013.01); H03H 2003/022 (2013.01); Y10T 29/42 (2015.01);
Abstract

A piezoelectric device includes a piezoelectric vibrating piece, a base plate, and a lid plate. The base plate includes one principal surface where the piezoelectric vibrating piece is placed and includes a connecting electrode electrically connected to the extraction electrode, and another principal surface including a mounting terminal. The lid plate seals the vibrator. The lid plate seals the vibrator. At least a part of the mounting terminal includes a first metal film, a second metal film, and an electroless plating film. The second metal film is formed to cover the first metal film or is formed at a part of a surface of the first metal film. The second metal film has a different area from the first metal film. The electroless plating film is formed at least on a surface of the second metal film by electroless plating.


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