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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9236551 B1

PDFFull Text
Date of Patent:
Jan. 12, 2016

Filed:

Aug. 30, 2013

Light emitting device and luminaire

Applicant:

Toshiba Lighting & Technology Corporation, Yokosuka-shi, Kanagawa-ken, JP;

Inventors:

Kiyoshi Nishimura, Yokosuka, JP;

Kazuo Shimokawa, Yokosuka, JP;

Nobuhiko Betsuda, Yokosuka, JP;

Akihiro Sasaki, Yokosuka, JP;

Miho Watanabe, Yokosuka, JP;

Hirotaka Tanaka, Yokosuka, JP;

Takuya Honma, Yokosuka, JP;

Katsuhisa Matsumoto, Yokosuka, JP;

Hideki Okawa, Yokosuka, JP;

Assignee:

Toshiba Lighting & Technology Corporation, Yokosuka-shi, Kanagawa-ken, JP;

Attorney:

Banner & Witcoff, Ltd.

Primary Examiner:

Julio J Maldonado

Assistant Examiner:

Moazzam Hossain

Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/48 (2010.01); H01L 23/42 (2006.01); H01L 33/64 (2010.01); H01L 25/075 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); F21Y 101/02 (2006.01); H01L 33/50 (2010.01); H05K 1/03 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H01L 33/644 (2013.01); H01L 25/0753 (2013.01); H05K 1/0209 (2013.01); H05K 3/0061 (2013.01); F21Y 2101/02 (2013.01); H01L 33/505 (2013.01); H01L 33/642 (2013.01); H01L 2224/16225 (2013.01); H05K 1/0306 (2013.01); H05K 3/284 (2013.01); H05K 2201/0305 (2013.01); H05K 2201/10106 (2013.01);
Abstract

According to one embodiment, there is provided a light-emitting device including a light-emitting section, a thermal radiation member, and a heat conduction layer. The light-emitting section includes a mounting substrate section and a light-emitting element section. The mounting substrate section includes a substrate, a first metal layer, and a second metal layer. The substrate includes a first principal plane including a mounting region and a second principal plane. The first metal layer includes mounting patterns provided in the mounting region. The light-emitting element section includes semiconductor light-emitting elements and a wavelength conversion layer. The semiconductor light-emitting elements are connected to the mounting patterns. The luminous existence of the light-emitting element section is equal to or higher than 10 lm/mmand equal to or lower than 100 lm/mm. The thermal radiation member has an area equal to or larger than five times the area of the mounting region.

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