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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9236541 B1

PDFFull Text
Date of Patent:
Jan. 12, 2016

Filed:

Sep. 18, 2014

Led package structures for preventing lateral light leakage and method of manufacturing the same

Applicants:

Brightek Optoelectronic (Shenzhen) Co., Ltd., Shenzhen, CN;

Brightek Optoelectronic Co., Ltd., Taoyuan County, TW;

Inventors:

Chien-Chung Huang, Taoyuan County, TW;

Chih-Ming Wu, Taoyuan County, TW;

Tung Po Huang, Taoyuan County, TW;

Assignees:

BRIGHTEK OPTOELECTRONIC (SHENZHEN) CO., LTD., Shenzhen, CN;

BRIGHTEK OPTOELECTRONIC CO., LTD., Taoyuan County, TW;

Attorney:

Li & Cai Intellectual Property (USA) Office

Primary Examiner:

Quoc Hoang

Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/58 (2010.01); H01L 33/54 (2010.01); H01L 27/15 (2006.01); H01L 33/50 (2010.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/58 (2013.01); H01L 24/97 (2013.01); H01L 27/153 (2013.01); H01L 33/0095 (2013.01); H01L 33/50 (2013.01); H01L 33/54 (2013.01); H01L 25/0753 (2013.01); H01L 33/505 (2013.01); H01L 33/60 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0058 (2013.01);
Abstract

An LED package structure for preventing lateral light leakage includes a substrate unit, a light-emitting unit, a light-transmitting unit and a light-shielding unit. The substrate unit includes a circuit substrate. The light-emitting unit includes at least one LED chip disposed on the circuit substrate and electrically connected to the circuit substrate. The light-transmitting unit includes a light-transmitting gel body disposed on the circuit substrate for enclosing the LED chip. The light-transmitting gel body has a first light-transmitting portion disposed on the circuit substrate for enclosing the LED chip and at least one second light-transmitting portion projected upwardly from the first light-transmitting portion and corresponding to the LED chip, and the second light-transmitting portion has a light output surface. The light-shielding unit includes a light-shielding gel body disposed on the circuit substrate for exposing the light output surface of the second light-transmitting portion.

Find Patent Forward Citations

Huang, Chien-Chung. (2016). Led package structures for preventing lateral light leakage and method of manufacturing the same (U.S. Patent No. 9236541). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9236541

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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