The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2016

Filed:

Dec. 20, 2013
Applicant:

Solexel, Inc., Milpitas, CA (US);

Inventors:

Mehrdad M. Moslehi, Los Altos, CA (US);

Virendra V. Rana, Los Gatos, CA (US);

Pranav Anbalagan, San Jose, CA (US);

Vivek Saraswat, Milpitas, CA (US);

Assignee:

Solexel, Inc., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 31/0236 (2006.01); B23K 26/06 (2014.01); B23K 26/073 (2006.01); B23K 26/36 (2014.01); B23K 26/40 (2014.01); H01L 31/068 (2012.01); H01L 31/18 (2006.01); H01L 31/056 (2014.01); H01L 31/0224 (2006.01); H01L 31/0352 (2006.01); H01L 31/0445 (2014.01); H01L 31/0216 (2014.01);
U.S. Cl.
CPC ...
H01L 31/02366 (2013.01); B23K 26/0656 (2013.01); B23K 26/073 (2013.01); B23K 26/367 (2013.01); B23K 26/409 (2013.01); B23K 26/4075 (2013.01); H01L 31/02167 (2013.01); H01L 31/02363 (2013.01); H01L 31/022441 (2013.01); H01L 31/035281 (2013.01); H01L 31/0445 (2014.12); H01L 31/056 (2014.12); H01L 31/068 (2013.01); H01L 31/0682 (2013.01); H01L 31/18 (2013.01); H01L 31/1804 (2013.01); H01L 31/186 (2013.01); H01L 31/1896 (2013.01); Y02E 10/547 (2013.01);
Abstract

A method for making an ablated electrically insulating layer on a semiconductor substrate. A first relatively thin layer of at least an undoped glass or undoped oxide is deposited on a surface of a semiconductor substrate having n-type doping. A first relatively thin semiconductor layer having at least one substance chosen from amorphous semiconductor, nanocrystalline semiconductor, microcrystalline semiconductor, or polycrystalline semiconductor is deposited on the relatively thin layer of at least an undoped glass or undoped oxide. At least a layer of borosilicate glass or borosilicate/undoped glass stack is deposited on the relatively thin semiconductor layer. The at least borosilicate glass or borosilicate/undoped glass stack is selectively ablated with a pulsed laser, and the relatively thin semiconductor layer substantially protects the semiconductor substrate from the pulsed laser.


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