The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2016

Filed:

Feb. 18, 2015
Applicant:

Xilinx, Inc., San Jose, CA (US);

Inventors:

Cinti X. Chen, Fremont, CA (US);

Myongseob Kim, Pleasanton, CA (US);

Xiao-Yu Li, Palo Alto, CA (US);

Mohsen H. Mardi, Saratoga, CA (US);

Assignee:

XILINX, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 25/00 (2006.01); H01L 23/544 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 23/49838 (2013.01); H01L 23/544 (2013.01); H01L 24/17 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54406 (2013.01); H01L 2223/54433 (2013.01); H01L 2223/54493 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/16113 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/1712 (2013.01); H01L 2224/17515 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/14 (2013.01);
Abstract

An apparatus for a stacked silicon interconnect technology (SSIT) product comprises an interposer die, a plurality of integrated circuit dies, a plurality of active components forming an active connection between the integrated circuit dies and the interposer die, and a plurality of dummy components at the interposer die, the dummy components not forming an active connection between the integrated circuit dies and the interposer die. At least a subset of the dummy components forms a pattern, and the pattern comprises an identifier for the interposer die.


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