The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2016
Filed:
Jul. 25, 2013
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventor:
Chan Park, Hwaseong-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-Si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/02 (2006.01); H01L 23/498 (2006.01); H01L 23/13 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 23/13 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 23/49827 (2013.01); H01L 24/13 (2013.01); H01L 24/97 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A semiconductor package includes a substrate having a vent hole extending through the substrate, a semiconductor chip mounted on an upper surface of the substrate, a plurality of solder ball pads formed on a lower surface of the substrate, and an encapsulant covering the upper surface of the substrate, the semiconductor chip, and an entirety of the lower surface of the substrate except for regions in which the solder ball pads are formed.