The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2016

Filed:

Aug. 01, 2014
Applicant:

Renesas Electronics Corporation, Kanagawa, JP;

Inventor:

Masato Numazaki, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/12 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49524 (2013.01); H01L 21/565 (2013.01); H01L 23/4952 (2013.01); H01L 23/49575 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 24/97 (2013.01); H01L 23/3107 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/78 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48479 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/85051 (2013.01); H01L 2224/85986 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/1306 (2013.01);
Abstract

A semiconductor device includes a base member and a first semiconductor chip mounted over the base member. The first semiconductor chip including a first circuit, a second circuit, and a third circuit arranged between the first circuit and the second circuit and a plurality of pads. The first, second and third circuits are arranged along a first side of the first semiconductor chip. In plan view, the pads are located outside of the circuits and include a plurality of first pads arranged at a first pitch, and a plurality of second pads arranged at the first pitch. A distance between a first pad group comprised of the first pads and a second pad group comprised of the second pads is larger than the first pitch. Further, in a plan view, a part of the third circuit is located between the first pad group and the second pad group.


Find Patent Forward Citations

Numazaki, Masato. (2016). Semiconductor device having a plurality of circuits arranged on a side of a semiconductor chip (U.S. Patent No. 9236333). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9236333

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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