The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9236321 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 12, 2016

Filed:

Jan. 30, 2013
Applicant:

Renesas Electronics Corporation, Kawasaki-shi, Kanagawa, JP;

Inventors:

Tomoaki Uno, Kanagawa, JP;

Tetsuya Kawashima, Nakagun Tokaimura Muramatsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/34 (2006.01); H01L 21/50 (2006.01); H01L 21/8234 (2006.01); H01L 27/088 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 21/50 (2013.01); H01L 21/823475 (2013.01); H01L 24/34 (2013.01); H01L 27/088 (2013.01); H01L 2224/40247 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73221 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); H01L 2924/30107 (2013.01);
Abstract

A conventional semiconductor device used for a power supply circuit such as a DC/DC converter has problems of heat dissipation and downsizing, in particular has the problems of heat dissipation and others in the event of downsizing. A semiconductor device has a structure formed by covering a principal surface of a semiconductor chip having the principal surface and a plurality of MIS type FETs formed over the principal surface with a plurality of metal plate wires having pectinate shapes; allocating the pectinate parts alternately in a planar view over the principal surface; and further electrically coupling the plural metal plate wires to a plurality of terminals.


Find Patent Forward Citations

Uno, Tomoaki. (2016). Semiconductor device and manufacturing method thereof (U.S. Patent No. 9236321). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9236321

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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