The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2016
Filed:
Aug. 29, 2013
Applicant:
SK Hynix Inc., Icheon-si, Gyeonggi-do, KR;
Inventors:
Young Hee Yoon, Icheon-si, KR;
Kang Seol Lee, Icheon-si, KR;
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2014.01); G01R 1/06 (2006.01); H01L 21/768 (2006.01); G11C 5/02 (2006.01); G11C 5/06 (2006.01); H01L 21/66 (2006.01); H01L 23/48 (2006.01); G11C 5/04 (2006.01); G11C 8/12 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76877 (2013.01); G11C 5/025 (2013.01); G11C 5/063 (2013.01); H01L 22/32 (2013.01); H01L 23/481 (2013.01); G11C 5/04 (2013.01); G11C 8/12 (2013.01); H01L 24/06 (2013.01); H01L 24/16 (2013.01); H01L 25/0657 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/06136 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06544 (2013.01);
Abstract
Provided is a semiconductor apparatus in which a plurality of semiconductor chips stacked in a vertical direction. Each of the semiconductor chips comprises: a bank area comprising a plurality of banks configured to store data; and a peripheral area including a pad area in which a plurality of pads configured to receive signals for controlling the bank area and a plurality of TSV for electrically connecting the plurality of pads, respectively.