The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2016

Filed:

Oct. 26, 2012
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Chien-Nan Yeh, Tainan, TW;

Chin-Hung Wang, Hsinchu, TW;

Hsin-Li Lee, Hsinchu, TW;

Jien-Ming Chen, Tainan, TW;

Tzong-Che Ho, Tainan, TW;

Li-Chi Pan, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); H01L 21/56 (2006.01); B81B 7/00 (2006.01); H04R 31/00 (2006.01); H04R 19/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/56 (2013.01); B81B 7/0061 (2013.01); H04R 31/006 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/012 (2013.01); B81B 2207/096 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/3025 (2013.01); H04R 19/005 (2013.01); H04R 2499/11 (2013.01); H04R 2499/15 (2013.01);
Abstract

A MEMS acoustic transducer is provided, which includes a substrate, a MEMS chip, and a housing. The substrate has a first opening area and a lower electrode layer disposed over a surface of the substrate, wherein the first opening area includes at least one hole allowing acoustic pressure to enter the MEMS acoustic transducer. The MEMS chip is disposed over the surface of the substrate, including a second opening area and an upper electrode layer partially sealing the second opening area, wherein the upper electrode layer and the lower electrode layer, which are parallel to each other and have a gap therebetween, form an induction capacitor. The housing is disposed over the MEMS chip or the surface of the substrate creating a cavity with the MEMS chip or the substrate. In addition, a method for fabricating the above MEMS acoustic transducer is also provided.


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