The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2016

Filed:

Dec. 12, 2014
Applicant:

Triton Microtechnologies, Oro Valley, AZ (US);

Inventors:

Tim Mobley, Marana, AZ (US);

Roupen Leon Keusseyan, Carlsbad, CA (US);

Assignee:

TRITON MICROTECHNOLOGIES, Oro Valley, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H05K 3/40 (2006.01); C03B 25/02 (2006.01); C03C 15/00 (2006.01); C03C 17/32 (2006.01); C03C 17/30 (2006.01); C03C 17/06 (2006.01); C03C 23/00 (2006.01); C03C 17/38 (2006.01); H01L 23/15 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H01L 21/486 (2013.01); C03B 25/025 (2013.01); C03C 15/00 (2013.01); C03C 17/06 (2013.01); C03C 17/30 (2013.01); C03C 17/32 (2013.01); C03C 17/38 (2013.01); C03C 23/0025 (2013.01); H01L 23/15 (2013.01); H05K 1/0306 (2013.01); H05K 3/4038 (2013.01); C03C 2217/25 (2013.01); C03C 2217/70 (2013.01); C03C 2218/31 (2013.01); C03C 2218/32 (2013.01);
Abstract

A method of processing a glass substrate for use in semi-conductor packaging applications. Through holes are created in a glass substrate and subsequently filled with a metallized paste material. The glass substrate is planarized after metallization to clean and flatten a surface of the glass substrate. The surface of the glass substrate is coated with at least one redistribution layer of a metal, a metal oxide, an alloy, a polymer, or a combination thereof. The paste material has improved adhesion to the through-holes. The filled through-holes are hermetic and have a low resistivity.


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