The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2016

Filed:

Aug. 15, 2013
Applicant:

Avx Corporation, Fountain Inn, SC (US);

Inventors:

Martin Biler, Lanskroun, CZ;

Ladislav Vilc, Lanskroun, CZ;

Assignee:

AVX Corporation, Fountain Inn, SC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/00 (2006.01); H01G 4/228 (2006.01); H01G 9/10 (2006.01); H01G 9/025 (2006.01); H01G 9/012 (2006.01); H01G 9/08 (2006.01); H01G 9/15 (2006.01);
U.S. Cl.
CPC ...
H01G 9/10 (2013.01); H01G 9/012 (2013.01); H01G 9/025 (2013.01); H01G 9/08 (2013.01); H01G 9/15 (2013.01);
Abstract

A capacitor assembly that contains a solid electrolytic capacitor element positioned within a multi-layered casing is provided. The casing contains an encapsulant layer that overlies the capacitor element and a moisture barrier layer that overlies the encapsulant layer. Through careful control of the materials employed in the casing, the present inventor has discovered that the resulting capacitor assembly can be mechanically stable while also exhibiting electrical properties in the presence of high humidity levels (e.g., relative humidity of 85%). For example, the encapsulant layer may be formed from a thermoset resin (e.g., epoxy) that is capable of providing the capacitor element with mechanical stability. The moisture barrier layer may likewise be formed from a hydrophobic material.


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